Effect of mechanical stress on the kinetics of heterogeneous electron transfer.

The scanning electrochemical microscope (SECM) combined with a computerized tensile stage was employed to measure the kinetics of electron transfer (ET) reactions at stainless steel electrodes as a function of the applied mechanical stress. Reproducible current versus distance curves were obtained for different values of the tensile stress applied to a stainless steel (T-316) sample by using hexaammineruthenium as a redox mediator. The dependences of the extracted rate constant on substrate potential (i.e., Tafel plots, ln k versus E) were linear, in agreement with classical electrochemical theory. Possible origins of the stress effect on the ET rate and its implications for studies of stress corrosion cracking are discussed.