Tool wear mechanism in ultrasonic-assisted grinding of SiCf/SiC composites.

Under severe cooling conditions, machining SiCf/SiC composites leads to pronounced tool wear, compromising machining efficiency. While ultrasonic-assisted grinding (UAG) demonstrates potential for enhancing surface quality, the wear characteristics of grinding tools in this process remain insufficiently characterized. This study employs tribological and kinematic analysis coupled with experimental verification to elucidate wear mechanisms. Results identify four principal wear modes: abrasive wear, fracture wear, grain detachment, and wheel clogging, involving both two-body and three-body wear. High-frequency ultrasonic vibrations induce surface microfracture of abrasive particles while sinusoidal scratch patterns form on the bond. Ultrasonic vibration substantially reduces debris adhesion, minimizing wheel clogging and extending tool life, thereby enhancing grinding performance. These findings facilitate parameter optimization for UAG in high-performance ceramic matrix composites.