Dental materials : official publication of the Academy of Dental Materials · 2025
Multifunctional CuS nanoparticle deposition for enhanced dentin bonding: Synergistic dehydration, MMP inhibition and antibacterial action.
СтатьяНазвание и аннотация: Перевод в очереди
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Yang Xue, Chen Yadong, Chen Yifan, Xu Jiajia, Yan Honghai, Luo Qiaojie, Yao Wei, Li Xiaodong
Аннотация
OBJECTIVE: To develop a multifunctional strategy based on in-situ copper sulfide (CuS) nanoparticle deposition, aiming to simultaneously mitigate interface-confined water to improve adhesive infiltration, suppress enzymatic degradation, and prevent bacterial colonization.
METHODS: Demineralized dentin matrices (DDM) were sequentially treated with CuSO₄ and Na₂S solutions at three concentrations (0.0015, 0.015, 0.15 mol/L), with conventional wet-bonding as a control. Nanoparticle distribution, matrix dehydration, matrix metalloproteinase (MMP) activity, antibacterial efficacy (Streptococcus mutans, Staphylococcus aureus and Escherichia coli), and bonding performance (nanoleakage, microtensile bonding strength) were systematically evaluated.
RESULTS: Uniform CuS deposition significantly reduced DDM hydration to release the interface-confined water. The 0.015 and 0.15 groups showed enhanced mechanical properties. Moreover, all concentrations of CuS deposition inhibited MMP and showed antibacterial effect. As a result, the 0.015 and 0.15 groups showed improved adhesive infiltration, reduced nanoleakage (p < 0.05) and increased both immediate and aged microtensile bonding strength (p < 0.01).
CONCLUSION: In-situ CuS nanoparticle deposition synergistically enhances bond durability, through DDM dehydration, MMP inhibition, and antibacterial action. This approach effectively minimizes hybrid layer defects and collectively prolongs bonding longevity.
CLINICAL SIGNIFICANCE: The Cu-assisted bonding technique provides a clinically feasible solution to address multifactorial failure modes in dentin bonding, leveraging nanomaterial synergy for durable adhesive restorations.
METHODS: Demineralized dentin matrices (DDM) were sequentially treated with CuSO₄ and Na₂S solutions at three concentrations (0.0015, 0.015, 0.15 mol/L), with conventional wet-bonding as a control. Nanoparticle distribution, matrix dehydration, matrix metalloproteinase (MMP) activity, antibacterial efficacy (Streptococcus mutans, Staphylococcus aureus and Escherichia coli), and bonding performance (nanoleakage, microtensile bonding strength) were systematically evaluated.
RESULTS: Uniform CuS deposition significantly reduced DDM hydration to release the interface-confined water. The 0.015 and 0.15 groups showed enhanced mechanical properties. Moreover, all concentrations of CuS deposition inhibited MMP and showed antibacterial effect. As a result, the 0.015 and 0.15 groups showed improved adhesive infiltration, reduced nanoleakage (p < 0.05) and increased both immediate and aged microtensile bonding strength (p < 0.01).
CONCLUSION: In-situ CuS nanoparticle deposition synergistically enhances bond durability, through DDM dehydration, MMP inhibition, and antibacterial action. This approach effectively minimizes hybrid layer defects and collectively prolongs bonding longevity.
CLINICAL SIGNIFICANCE: The Cu-assisted bonding technique provides a clinically feasible solution to address multifactorial failure modes in dentin bonding, leveraging nanomaterial synergy for durable adhesive restorations.