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Войти в исследования Dental materials : official publication of the Academy of Dental Materials · 2026
Comparison of methods for evaluating interfacial fracture toughness and bond strength of adhesives to dentin.
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Moreira Paulo Matias, Araújo-Neto Vitaliano Gomes de, Giannini Marcelo
Аннотация
OBJECTIVES: To compare four mechanical tests used to evaluate bond strength and mode I fracture toughness (KIc) of dental adhesives, based on data consistency and variability.
METHODS: Two nominal bond strength tests, microtensile bond strength (µTBS) and mold-enclosed shear bond strength (ME-SBS), and two KIc tests, notchless triangular prism (NTP) and split-chevron-notched-beam (SCNB), were performed to evaluate a two-step self-etch primer (Clearfil SE Bond II, CSE) and a universal adhesive applied in etch-and-rinse mode (Tetric N-Bond Universal, TNB). Failure patterns were analyzed by scanning electron microscope. Data was analyzed using Student's and Welch's t-tests and Weibull analysis in IBM SPSS Statistics (IBM Corp.).
RESULTS: For µTBS, no significant differences were observed between TNB and CSE at 24 h or 1 year, and aging did not affect either adhesive (p > 0.05). For ME-SBS, aging significantly reduced bond strength for TNB (p < 0.05). For KIc measured by NTP and SCNB, no significant differences were observed among adhesives at either storage time (p > 0.05). However, TNB at 1-year storage significantly reduced KIc in both tests (p < 0.05). Weibull analysis showed a higher Weibull modulus for µTBS than for ME-SBS.
SIGNIFICANCE: Bonding tests are essential to assess adhesive system quality and to guide material development and clinical application protocols. Therefore, it is clinically relevant to determine whether these testing methods are reliable for these purposes.
METHODS: Two nominal bond strength tests, microtensile bond strength (µTBS) and mold-enclosed shear bond strength (ME-SBS), and two KIc tests, notchless triangular prism (NTP) and split-chevron-notched-beam (SCNB), were performed to evaluate a two-step self-etch primer (Clearfil SE Bond II, CSE) and a universal adhesive applied in etch-and-rinse mode (Tetric N-Bond Universal, TNB). Failure patterns were analyzed by scanning electron microscope. Data was analyzed using Student's and Welch's t-tests and Weibull analysis in IBM SPSS Statistics (IBM Corp.).
RESULTS: For µTBS, no significant differences were observed between TNB and CSE at 24 h or 1 year, and aging did not affect either adhesive (p > 0.05). For ME-SBS, aging significantly reduced bond strength for TNB (p < 0.05). For KIc measured by NTP and SCNB, no significant differences were observed among adhesives at either storage time (p > 0.05). However, TNB at 1-year storage significantly reduced KIc in both tests (p < 0.05). Weibull analysis showed a higher Weibull modulus for µTBS than for ME-SBS.
SIGNIFICANCE: Bonding tests are essential to assess adhesive system quality and to guide material development and clinical application protocols. Therefore, it is clinically relevant to determine whether these testing methods are reliable for these purposes.