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Progress in molecular biology and translational science · 2025

Engineering aspects and materials for next generation neural implants.

СтатьяОбзорНазвание и аннотация: Перевод пока не подготовлен
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Mahato Kuldeep

Аннотация

Nano-electronics based neural implants represent a rapidly advancing interdisciplinary domain at the intersection of bioelectronics, nanotechnology, and neuro-engineering. These implantable systems are engineered to restore, modulate, or augment neural functions by establishing high-fidelity, long-term interfaces with neural tissues. The design of such implants necessitates careful consideration of both materials and structural configurations to ensure biocompatibility, mechanical compliance, electrical functionality, and chronic stability. Recent innovations in nanomaterials including graphene, carbon nanotubes, and conductive polymers have significantly enhanced the bio-integration and functional longevity of these devices. Furthermore, the incorporation of soft hydrogels, nanostructured coatings, and stretchable electronic platforms mitigates immune responses and supports intimate neural contact. On the system level, design strategies prioritize miniaturization, wireless communication, and energy-efficient architectures, enabling real-time monitoring and closed-loop neuromodulation. Multimodal capabilities-combining sensing, stimulation, and drug delivery-further augment the therapeutic potential of these implants for managing complex neurological conditions such as Parkinson's disease, epilepsy, and spinal cord injuries. This review outlines the critical materials and engineering principles underpinning the development of bio-nano-electronic neural implants, emphasizing their role in advancing personalized neurotherapeutics and improving patient outcomes. The integration of smart materials with neural interface technologies holds substantial promise for enhancing the quality of life in individuals affected by neurological dysfunction.

Предметные рубрики MeSH

ИП Урсолов Владлен Сергеевич

ИНН 500118482352 · ОГРНИП 314500117700049

Реквизиты и контакты