Intelligent packaging for tofu preservation: a comprehensive review of advanced materials and pathways toward integrated AI-driven systems.

Tofu, a highly perishable and increasingly popular global staple, has received limited research attention regarding intelligent packaging. This review systematically consolidates recent advances, spanning molecular spoilage mechanisms to prospective integrated AI-driven systems. It analyzes two main pillars: advanced materials-evolving from controlled-release to stimuli-responsive systems-highlighting development directions for tofu-specific smart packaging; and sensing technologies-including visual indicators and embedded sensors-documenting failure modes and matrix interference. The discussion culminates in a conceptual framework for AI-enabled systems, noting that no fully integrated implementation currently exists for tofu. It identifies integration gaps, hardware constraints, and the absence of tofu-specific datasets. Additionally, IoT and blockchain technologies are evaluated for connectivity and trust throughout the supply chain. Finally, key commercialization challenges-technical, economic, regulatory, and environmental-are synthesized, and a co-design research agenda is proposed. This work provides a roadmap for next-generation intelligent packaging to enhance shelf life, safety, and supply chain efficiency for tofu and other perishable foods.