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DOI 10.1038/s41598-022-08448-x

Медицинская библиотека · Scientific reports · 2022

Evaporation-controlled dripping-onto-substrate (DoS) extensional rheology of viscoelastic polymer solutions.

Robertson Benjamin P, Calabrese Michelle A

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Аннотация

Extensional flow properties of polymer solutions in volatile solvents govern many industrially-relevant coating processes, but existing instrumentation lacks the environment necessary to control evaporation. To mitigate evaporation during dripping-onto-substrate (DoS) extensional rheology measurements, we developed a chamber to enclose the sample in an environment saturated with solvent vapor. We validated the evaporation-controlled DoS device by measuring a model high molecular weight polyethylene oxide (PEO) in various organic solvents both inside and outside of the chamber. Evaporation substantially increased the extensional relaxation time [Formula: see text] for PEO in volatile solvents like dichloromethane and chloroform. PEO/chloroform solutions displayed an over 20-fold increase in [Formula: see text] due to the formation of an evaporation-induced surface film; evaporation studies confirmed surface features and skin formation reminiscent of buckling instabilities commonly observed in drying polymer solutions. Finally, the relaxation times of semi-dilute PEO/chloroform solutions were measured with environmental control, where [Formula: see text] scaled with concentration by the exponent [Formula: see text]. These measurements validate the evaporation-controlled DoS environment, and confirm that chloroform is a good solvent for PEO, with a Flory exponent of [Formula: see text]. Our results are the first to control evaporation during DoS extensional rheology, and provide guidelines establishing when environmental control is necessary to obtain accurate rheological parameters.

Для цитирования: Robertson Benjamin P, Calabrese Michelle A. Evaporation-controlled dripping-onto-substrate (DoS) extensional rheology of viscoelastic polymer solutions.. Scientific reports. 2022. DOI: 10.1038/s41598-022-08448-x.

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