Comparative Study on the Cutting Effectiveness and Heat Generation of Rotary Instruments Versus Piezoelectric Surgery Tips Using Scanning Electron Microscopy and Thermal Analysis.

PURPOSE: The search for optimizing rehabilitation results with the use of osseointegrated implants has led oral surgeons to look for other technologies that can provide better predictability for treatments; however, effectiveness must be considered as well. This study aimed to compare temperature variation during preparation of implant surgical beds using conventional rotary implant burs versus ultrasonic tips and to study perforation effectiveness by analyzing the functional wear of both systems and the influence of such wear on the overheating of cortical bone.

MATERIALS AND

METHODS

This evaluation was made using thermocouples placed in fresh bovine cortical bone (femur) and connected to a data collector so that the recorded temperatures could provide the thermal behavior of both systems after repeated use of the burs and piezoelectric tips, to compare the wear and the loss of cutting efficiency. Scanning electron microscopy (SEM) was used to compare the topography of both systems' perforations. Biostatistics assays were performed comparing both techniques as well.

RESULTS

The collected data and images showed that the wear of the burs and tips did not significantly influence the temperature variation, and the greatest variation occurred in the piezoelectric system for preparations of 13-mm depth. The SEM images show a different surface topography between both systems. While the burs cut the bone, showing a smooth surface, the piezoelectric tips condense the bone and present a rough surface.

CONCLUSION

The use of either rotatory burs or piezoelectric tips generates a temperature that does not affect the tissue healing. Burs create a smooth surface, and piezoelectric tips show a more rough and condensed bone surface. The wear of both systems does not have a relevant increase in temperature after the preparation of 30 surgical beds.