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ACS nano · 2018

Hexagonal Boron Nitride: The Thinnest Insulating Barrier to Microbial Corrosion.

СтатьяПоддержка правительства СШАНазвание и аннотация: Перевод в очереди
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Chilkoor Govinda, Karanam Sushma Priyanka, Star Shane, Shrestha Namita, Sani Rajesh K, Upadhyayula Venkata K K, Ghoshal Debjit, Koratkar Nikhil A, Meyyappan M, Gadhamshetty Venkataramana

Аннотация

We report the use of a single layer of two-dimensional hexagonal boron nitride (SL-hBN) as the thinnest insulating barrier to microbial corrosion induced by the sulfate-reducing bacteria Desulfovibrio alaskensis G20. We used electrochemical methods to assess the corrosion resistance of SL-hBN on copper against the effects of both the planktonic and sessile forms of the sulfate-reducing bacteria. Cyclic voltammetry results show that SL-hBN-Cu is effective in suppressing corrosion effects of the planktonic cells at potentials as high as 0.2 V ( vs Ag/AgCl). The peak anodic current for the SL-hBN coatings is ∼36 times lower than that of bare Cu. Linear polarization resistance tests confirm that the SL-hBN coatings serve as a barrier against corrosive effects of the G20 biofilm when compared to bare Cu. The SL-hBN serves as an impermeable barrier to aggressive metabolites and offers ∼91% corrosion inhibition efficiency, which is comparable to much thicker commercial coatings such as polyaniline. In addition to impermeability, the insulating nature of SL-hBN suppresses galvanic effects and improves its ability to combat microbial corrosion.

Предметные рубрики MeSH

ИП Урсолов Владлен Сергеевич

ИНН 500118482352 · ОГРНИП 314500117700049

Реквизиты и контакты