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DOI 10.1016/j.msec.2018.01.007

Медицинская библиотека · Materials science & engineering. C, Materials for biological applications · 2018

Advancing the frontiers of silk fibroin protein-based materials for futuristic electronics and clinical wound-healing (Invited review).

Koh Leng-Duei, Yeo Jingjie, Lee Yeong Yuh, Ong Qunya, Han Mingyong, Tee Benjamin C-K

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Аннотация

The present review will introduce the basic concepts of silk-based electronics/optoelectronics including the latest technological advances on the use of silk fibroin in combination with other functional components, with an emphasis on improving the performance of next-generation silk-based materials. It also highlights the patterning of silk fibroin to produce micro/nano-scale features, as well as the functionalization of silk fibroin to impart antimicrobial (i.e. antibacterial) properties. Silk-based bioelectronics have great potential for advanced or futuristic bio-applications including e-skins, e-bandages, biosensors, wearable displays, implantable devices, artificial muscles, etc. Notably, silk-based organic field-effect transistors have highly promising applications in e-skins and biosensors; silk-based electrodes/antennas are used for in vivo bioanalysis or sensing purpose (e.g., measurement of neurotransmitter such as dopamine) in addition to their use as food sensors; silk-based diodes can be applied as light sources for wound healing or tissue engineering, e.g., in cutaneous wound closure or induction of photothrombosis of corneal neovascularization; silk-based actuators have promising applications as artificial muscles; whereas silk-based memristors have exciting applications as logic or synaptic network for realizing e-skins or bionic brains.

Для цитирования: Koh Leng-Duei, Yeo Jingjie, Lee Yeong Yuh, Ong Qunya, Han Mingyong, Tee Benjamin C-K. Advancing the frontiers of silk fibroin protein-based materials for futuristic electronics and clinical wound-healing (Invited review).. Materials science & engineering. C, Materials for biological applications. 2018. DOI: 10.1016/j.msec.2018.01.007.

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