Bioaccumulation of copper by Trichoderma viride.

Studies were carried out on interaction of Trichoderma viride with copper and reports bioaccumulation as a mechanism of copper tolerance during growth. There was a marked increase in the lag phase of the growth, which was concentration dependent. At a concentration of 100 mg/L of CuCl2.2H2O, 81% of Cu(II) were removed by 3.4 g/L of the biomass in 72 h. The process was temperature and pH dependent. The maximum copper bioaccumulation occurred at 30 degrees C, pH 5.0. Metabolic inhibitors such as sodium azide (NaN3) and 2,4-dinitrophenol (2,4-DNP) drastically reduced the extent of Cu(II) bioaccumulation. Electron microscopy and cell fractionation studies revealed that 70-80% of copper was present as a layer on the cell wall surface.